Self-contained and modular air-cooled containerized server cooling

ABSTRACT

A modular server cooling unit user standard dimension modules to build a variety of components for use in cooling a server or server farm. One module may be the module in which the server(s) are mounted. Another module may be an exhaust plenum, drawing air through the server module and exhausting the air to the outside. A third module may be a cooling module through which outside air is drawn, filtered and optionally cooled, for example, using an adiabatic, or water-wash, cooler. Exhaust air may be selectively mixed with air from the cooling module to provide finer control of server temperature and humidity.

BACKGROUND

Providing a controlled climate for computer servers and other sensitiveequipment is traditionally accomplished by placing the servers in a roomwith climate controls and may include a raised floor, conditioned power,etc. Each server room has separate power cabling, duct work forconditioned and return air, filters, and airlocks, as required. Size andcapacity changes to accommodate increased or reduced space or airconditioning needs are usually costly, if possible at all.

SUMMARY

One or more servers may be mounted inside a modular cooling environmentthat provides interchangeable cooling heads to accommodate differentrequirements. Each module may connect with other modules to providehumidity control, air recirculation, filtering, etc. Assembled modulesmay be stacked to accommodate additional servers/server racks. In someembodiments, different cooling modes may be exchanged to meet seasonalneeds. For example, an adiabatic (swamp) cooler may be used in a desertclimate in the most seasons, while a chilled water module may be used inthe deep summer when high heat and humidity may require more temperaturechange than can be met using the adiabatic cooling module.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of one embodiment of a modular server coolingsystem;

FIG. 2 is a block diagram of another embodiment of a modular servercooling system;

FIG. 3 is a block diagram of yet another embodiment of a modular servercooling system;

FIG. 4 is a block diagram of a fourth embodiment of a modular servercooling system;

FIG. 5 is a block diagram of a fifth embodiment of a modular servercooling system;

FIG. 6 is a top view diagram of a mechanical drawing of a modular servercooling system;

FIG. 7 is a side view diagram of the mechanical drawing of FIG. 6; and

FIG. 8 is a flow chart of a method of cooling a server using a modularserver cooling system.

DETAILED DESCRIPTION

Although the following text sets forth a detailed description ofnumerous different embodiments, it should be understood that the legalscope of the description is defined by the words of the claims set forthat the end of this disclosure. The detailed description is to beconstrued as exemplary only and does not describe every possibleembodiment since describing every possible embodiment would beimpractical, if not impossible. Numerous alternative embodiments couldbe implemented, using either current technology or technology developedafter the filing date of this patent, which would still fall within thescope of the claims.

It should also be understood that, unless a term is expressly defined inthis patent using the sentence “As used herein, the term ‘______’ ishereby defined to mean . . . ” or a similar sentence, there is no intentto limit the meaning of that term, either expressly or by implication,beyond its plain or ordinary meaning, and such term should not beinterpreted to be limited in scope based on any statement made in anysection of this patent (other than the language of the claims). To theextent that any term recited in the claims at the end of this patent isreferred to in this patent in a manner consistent with a single meaning,that is done for sake of clarity only so as to not confuse the reader,and it is not intended that such claim term by limited, by implicationor otherwise, to that single meaning. Finally, unless a claim element isdefined by reciting the word “means” and a function without the recitalof any structure, it is not intended that the scope of any claim elementbe interpreted based on the application of 35 U.S.C. §112, sixthparagraph.

Much of the inventive functionality and many of the inventive principlesare best implemented with or in software programs or instructions andintegrated circuits (ICs) such as application specific ICs. It isexpected that one of ordinary skill, notwithstanding possiblysignificant effort and many design choices motivated by, for example,available time, current technology, and economic considerations, whenguided by the concepts and principles disclosed herein will be readilycapable of generating such software instructions and programs and ICswith minimal experimentation. Therefore, in the interest of brevity andminimization of any risk of obscuring the principles and concepts inaccordance to the present invention, further discussion of such softwareand ICs, if any, will be limited to the essentials with respect to theprinciples and concepts of the preferred embodiments.

FIG. 1 illustrates a first embodiment of a modular server cooling unit100. A first, server module 102 may be used to hold the servers 104 andmay include a intake space 106, and an exit space 108. When minimalcooling is required, or if outside air is suitable for primary use, theoutside air may be brought in through a filter 110. The filter 110 maybe a simple disposable paper filter.

A second, plenum module 112 may be a simple large cavity 114 for drawingair from the exit space 108 of the server module 102. An exhaust fan 116may be used to remove the exit air from the plenum module 112. As can beseen from the illustration, because each module has standard dimensions,they may be attached as needed, as further shown below.

FIG. 2 illustrates another modular server cooling unit 200. In thisembodiment, the server module 202 and a heat plenum module 204 may bethe same as the corresponding modules from FIG. 1. In this embodiment,additional cooling may be required so instead of the simple filter 110of FIG. 1, an entire cooling module 208 may be added. The cooling module208 may include a filter 210, and an adiabatic cooler 212, that is, aporous filter through which water is dripped as air is drawn through theporous filter to cool the air. Such coolers are common in dry climates.The cooling module 208 may also include a mixing box 214 where warmedair may be recirculated, for example, when the inlet air temperature istoo low.

A heat transfer module 216 may be used to facilitate the recirculationof air from the heat plenum module 204 to the cooling module 208. Adamper 218 may be used to control outside air flow into the coolingmodule 208 and another damper 220 may be used to mix recirculated airinto the mixing box 214.

In operation, outside air may be drawn into the mixing box 214, may befiltered at filter 210 and cooled and humidified at adiabatic cooler212. The heat plenum module 204 may drawn air from the server module 202either by means of the exhaust fan 206 or by drawing air into the heattransfer module 216 and mixing the air into the cooling module 208. Anumber of sensors 222, 224, 226 may sense temperature, humidity andpressure, respectively for use in controlling dampers 218 and 220 andthe speed of fans 206 and 228 for managing air flow, temperature andhumidity.

FIG. 3 illustrates another embodiment of a modular server cooling unit300. In this embodiment, the server module 302, a heat plenum module304, a cooling module 308 and a heat transfer module 310 may operate asdescribed above with respect to FIG. 2. Cooling coils 308 may be addedto the cooling module 306 to provide more aggressive cooling than may beavailable with the simple adiabatic cooler 212 of FIG. 2. For example,the cooling coils 308 may be coupled to an external cooling tower 312,local water infrastructure 314, or a natural water source 316 to provideadditional cooling, as required. Temperature and humidity sensors mayallow a transition from adiabatic cooling to traditional airconditioning as required to meet heat and humidity requirements in theserver module 302.

FIG. 4 illustrates another embodiment of a modular server cooling unit400. In this embodiment, the server module 402, a heat plenum module404, a cooling module 408 and a heat transfer module 406 may operate asdescribed above with respect to FIGS. 2 and 3. The cooling coils 308 maybe supplemented or replaced by cooling coils 412, providing highercapacity cooling than is available from the chilled or natural watersources FIG. 3. A variety of known cooling techniques may be used toprovide this additional cooling, for example, a DX evaporative condenser414, an air cooled condenser 416, an air cooled chiller 418, or a watercooled chiller 420. Other techniques may also be used to provide coolingin association with the cooling coils 412. To provide a higher qualityserver environment, one or more filters 410 may be used to purify theair.

FIG. 5 is another embodiment of a modular server cooling unit 500. Inthis embodiment, four server modules 502, 504, 506, and 508 areaccommodated. Modular power units 510 and 512 may couple power from anoutside source (not depicted) to the server modules 502, 504, 506, 508.Cooling modules 514 and 516 may include adiabatic coolers 518 and 520,respectively. Heat transfer modules 522 and 524 provide a path forcooled air to travel from the cooling modules 514 and 516 throughrespective adjustable grates 530, 532, 534, and 536 and through eachserver module. A return exhaust plenum 546 draws air through the servermodules 502, 504, 506 and 508. An exhaust fan 552 may be used to removethe exhaust air. Return fans 526 and 528 may draw air from the returnexhaust plenum 546 through adjustable dampers 548 and 550. In oneembodiment, air from the exhaust plenum 546 may be cooled by coolingcoils 525 and 527. To adjust the mix of input and return air, intakedampers 538 and 540 may be used in combination with the adjustabledampers 548 and 550. Coolers 542 and 544, similar to any of the coolingmechanisms described above may be used in conjunction with cooling coils525 and 527 to provide cooling to the cooling unit 500.

FIG. 6 illustrates a top view of an embodiment of a modular cooling unit600, illustrating side-by-side expansion. Each bay 602, 604, 606, and608 may contain one or more server modules 610, and an adiabatic cooler612. Exemplary doors 614 and 618 may be opened to provide access tofilters and servers. Access to other areas of the cooling unit 600 maybe provided by additional access doors as shown. If each bay isconsidered to define a plane, bays may be expanded perpendicularly tothe plane.

FIG. 7 illustrates a side view 700 of the modular cooling unit 600. FIG.7 illustrates the server module 702, the adiabatic cooler module 704,and an exhaust fan 706. An adjustable damper 708 allows controllermixing of exhaust air with inlet air. A filter 710 may provide a firstlevel of air filtering before the adiabatic cooler module 704.

FIG. 8 is a flow chart of a method for providing a modular cooling unit,such as the modular cooling unit 400 of FIG. 4. At block 802, aplurality of common-sized modules may be provided. The modules may beuniform in size or may be constructed on a standard grid, such as a onehalf or a one quarter grid, allowing, for example, doubling the numberof units in a module space. Commonly dimensioned mounting points mayallow easy mechanical connections both module-to-module andmodule-to-building/floor.

At block 804, common-sized modules may be adapted to provide a servermodule 402, with server mounting hardware (not depicted), such as astandard rack mount or blade mount chassis, a heat plenum module 404with inlet and exhaust vent points, and a cooling module 410 with one ormore filtering and cooling inserts, such as an adiabatic cooler, coolingcoil, filter, or all of these.

At block 806, in some embodiments a heat transfer plenum module 406 maybe provided to selectively (controllably) return exhaust air to thecooling module to allow adjustment of temperature and humidity. In someembodiments, air to or from the cooling module may be adjusted as partof the exhaust air mixing process.

At block 808, the server 402, heat plenum 404, heat transfer 406 (ifused) and cooling module 410 may be mechanically and electricallyattached to each other as required. The components may be removablyattached, e.g., bolted or clipped together, to allow easy maintenanceand upgrade. An optional power module, e.g. module 510 of FIG. 5 may beused to condition and supply power to the server module 402 and othermodules as required. Standardized power connection points may be used toaccommodate wiring between those modules requiring power connections.When power requirements cannot be determined, or may vary over time, forexample, in a server module, channels may be provided to allow differentgauge wires or busses to be routed as needed.

At block 810, server computers (not depicted) may be mounted in theserver module 402.

At block 812, the cooling module 410 may be configured as needed and asdescribed above, to include elements from a simple filter to anadiabatic cooler to cooling coils connected to an external condenser orwater chilled cooler.

At block 814, the system 400 may be operated, so that outside air may becirculated through the cooling module 410, through the server module 402and into the heat plenum 404. At the heat plenum 404, the air mayexhausted to the outside.

At block 816, air from the heat plenum 404 may be returned to the servermodule 402 via the heat transfer plenum 406.

Although the foregoing text sets forth a detailed description ofnumerous different embodiments of the invention, it should be understoodthat the scope of the invention is defined by the words of the claimsset forth at the end of this patent. The detailed description is to beconstrued as exemplary only and does not describe every possiblyembodiment of the invention because describing every possible embodimentwould be impractical, if not impossible. Numerous alternativeembodiments could be implemented, using either current technology ortechnology developed after the filing date of this patent, which wouldstill fall within the scope of the claims defining the invention.

Thus, many modifications and variations may be made in the techniquesand structures described and illustrated herein without departing fromthe spirit and scope of the present invention. Accordingly, it should beunderstood that the methods and apparatus described herein areillustrative only and are not limiting upon the scope of the invention.

1. A modular environment for use with computer equipment, the systemcomprising: a module base for use by all other modules, the module baseproviding standard dimensions and connection points for fastening onemodule to another and for coupling power from one module to another; aserver module constructed from a first base module for mounting aplurality of servers; a heat plenum module constructed from a secondbase module and connected to the server module for collecting exhaustair from the server module; a cooling module constructed from a thirdbase module connected to the server module for taking input air andproviding at least filtered air to the server module; and a transferplenum module constructed from a fourth base module coupled between theheat plenum module and the cooling module for returning air from theheat plenum module to the cooling module.
 2. The modular environment ofclaim 1, further comprising a power module constructed from a fifthmodular base comprising switchgear and an uninterruptible power supply(UPS)
 3. The modular environment of claim 1, wherein the cooling modulecomprises an adiabatic cooler that drips water through a porous meshthrough which the input air passes and is cooled and humidified beforepassing to the server module.
 4. The modular environment of claim 1,wherein the cooling module comprises a coupling to an air-cooledchiller.
 5. The modular environment of claim 1, wherein the coolingmodule comprises a cooling coil and a coupling to a cooling tower. 6.The modular environment of claim 1, wherein the cooling module comprisesa cooling coil and a coupling to an external chiller.
 7. The modularenvironment of claim 1, further comprising an exhaust fan coupled to theheat plenum to vent air from the server module via the heat plenum.
 8. Amethod of cooling one or more computer servers comprising: providing aplurality of common-sized modules and adapting one or more the pluralityof modules to specific purposes for server cooling; creating a servermodule from one of the plurality of common-sized modules; creating aheat plenum module from one of the plurality of common-sized modules;creating a cooling module from one of the plurality of common-sizedmodules; connecting the server module to the heat plenum module;mounting the one or more computer servers in the server module;removeably coupling the server module to cooling module; drawing outsideair through the cooling module; filtering the outside air in the coolingmodule; providing the filtered air to the server module; drawing thefiltered air from the server module into the heat plenum; and exhaustingthe air from the heat plenum.
 9. The method of claim 10, furthercomprising: creating a heat transfer plenum from one of the plurality ofcommon-sized modules; connecting the heat transfer plenum so that airfrom the heat plenum is controllably returned to the cooling module. 10.The method of claim 11, wherein exhausting the air from the heat plenumcomprises exhausting at least a portion of the air into the heattransfer plenum.
 11. The method of claim 10, further comprising:attaching a second server module, a second heat plenum module, and asecond cooling module together and mounting each to its correspondingmodule from claim 10, so that the set of second modules is mountedperpendicularly to a plane created by the server module, heat plenummodule and cooling module.
 12. The method of claim 10, furthercomprising: creating a switchgear module from one of the plurality ofcommon-sized modules; and coupling the switchgear module to servermodule, wherein the switchgear module provides conditioned power to theserver module.
 13. A server cooling system comprising: a server modulefor disposing at least one server; a power unit module comprising autility power connection and an uninterruptible power supply (UPS)directly coupled the server module, for providing power to the servermodule; a cooling module for taking input air, filtering and cooling theinput air for use in cooling the server module; an exhaust plenum forcollecting air from the server module; and a heat transfer module forselectively mixing air from the exhaust plenum with air from the coolingmodule for use in cooling the server module.
 14. The server coolingsystem of claim 15, wherein the cooling module contains an adjustableintake damper that limits the amount of outside air brought into thecooling module.
 15. The server cooling system of claim 15, wherein theheat transfer module comprises an adjustable exhaust damper thatselectively allows air from the exhaust plenum to be vented into theheat transfer module and a grate that passes air from the heat transfermodule to the server module.
 16. The server cooling system of claim 15,further comprising an exhaust fan coupled to the exhaust plenum forexhausting air in the exhaust plenum.